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Digital Image Correlation (DIC)

Digital Image Correlation (DIC) Systems for Engineering Education. DefleX® by TecQuipment. 

TecQuipment’s Digital Image Correlation (DIC) Range, comprising of our DefleX® products, gives engineering students hands-on experience with an advanced, industry-standard technique for full-field strain, deformation, and displacement measurement. 

Optical-Extensometry

Widely used in product development, material testing, and finite element analysis (FEA) model validation, DIC is a powerful non-contact optical method that captures how materials and structures behave under varying loads. It enables precise visualisation of stress-strain behaviour, even when changes are invisible to the naked eye. DIC can be your next powerful teaching tool.

Designed for the academic environment, DefleX®-2D and DefleX®-3D offer an accessible, real-time and playback learning experience that integrates seamlessly with products in TecQuipment’s materials testing, next generation structures and theory of machines range.

Students studying mechanical, civil, aerospace and materials engineering benefit from using tools that reflect those found in research labs and engineering industries.

Designed for teaching, by incorporating DIC into the curriculum, educators can:
•    Teach advanced strain measurement and analysis techniques
•    Support student understanding of FEA validation
•    Help students visualise dynamic deformations and vibrations
•    Equip learners with industry-relevant digital testing skills

DefleX® is offered with an education licence, making it ideal for undergraduate and postgraduate engineering teaching laboratories. DefleX® gives students the same digital tools used in modern industry. For research applications, please contact us to discuss how the system can be tailored to meet your requirements.

Defle X brochure cover 0325

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